We are delighted to provide a BGA re-balling service is a service in which Greasley Electronics can now provide. We purchased a BGA (Ball Grid Array) Rework and Re-balling Machine last year and have put it to good use in those months! This semi-automatic system easily handles small or large printed circuit boards.
BGA re-balling service
Re-balling services and innovative technologies such as high-resolution camera placement, hybrid heating using infrared and convection, and the intuitive software ensures repeatable component alignment. It also does automatic soldering, thus minimizing operator reliance.
Guy loves being involved in our BGA re-balling service and by using this machine and is never happier than when he has faced with a challenging task. It takes consideration, concentration and precision to get the balls, using the camera exact alignment, in the right place and to be as accurate as possible.
With a carefully trained eye, chips are cleaned of excess solder, re-balled and after the re-work machine has been re-aligned, chips should be back in full working order!
Watch this video! – Guy is here ensuring the re-balling of the chip is smoothly inserted.😀 Air conditioning pcb’s are repaired using this system.
It is configured for residual solder removal and dispensing of flux or solder paste. We are using the machine in particular for the air conditioning controllers we repair on a daily basis.
This system provides reproducible solder bumping technology for packaging electronic devices, MEMS, sensors, BGA’s, CLCC’s, CSP’s, Flip Chips. Solder ball reflow is performed by a laser system using an infrared wavelength. All components of the system are integrated into a single cabinet.
Greasley’s love a new opportunity to save our customers money with electronic repair and refurbishment and we feel this is the next level with our BGA re-balling service. Contact one of the team here to enquire about how we can help. Alternatively give us a call on 01530 835823.
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