A new investment for the team at Greasley Electronics is the addition of a –
BGA (Ball Grid Array) Rework and Reballing Machine
This semi-automatic system easily handles small or large printed circuit boards. Innovative technologies such as high-resolution camera placement, hybrid heating using infrared and convection, and the intuitive software ensure repeatable component alignment and automatic soldering, thus minimizing operator reliance. It is configured for residual solder removal and dispensing of flux or solder paste.
Once calibrated, this machine has the ability to set endless templates and with hot gas, facilitates the reliable and precise rework. It uses an automated system to pick and place almost any component and has 99.9% accuracy.
With a carefully trained eye, chips are cleaned of excess solder, re-balled and after the re-work machine has been re-aligned, chips should be back in full working order!
Guy is here ensuring the re-balling of the chip is smoothly inserted.
Here, the work is done, chip replaced, tested it is ‘on line’ and then packaged up and sent back to the customer. By upgrading our machine, technically we can offer a very high standard of repair with efficiency and accuracy. Today we have been repairing air conditioning units for a company in Bristol and have complete confidence that these printed circuit boards will work effectively going forward.
When manufacturers are buying machinery into the UK with circuit board repairs that they think cannot be done, Greasley Electronics can be on hand with their expertise and fully trained engineers.
For more information our the newly installed machine, take a look here.